New SAKI Vision Technologies



In July 2018 NPE has updated its SMT production lines with 2 SAKI BF-3Si In-line 3D Solder Paste Inspection Systems.

Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology.
Solder paste inspection combines full-color 2D and 3D images and is based on 3D data. 2D imaging captures fiducial recognition and coordinate adjustment, while 3D imaging provides highly accurate height measurement with pad-based warpage compensation. The condition of the solder paste is measured and automatically judged in 3D for each pad using Saki’s proprietary height measurement technology.
Closed-loop function
The closed-loop function permits the BF-3Si solder paste measurement data to be fed back to the front-end process, thereby greatly minimizing potential solder defects throughout the remainder of the process. Data is analyzed and appears in a process control chart that shows real-time data as well as hourly summaries.